Clamping devices for the Semiconductor industry made out of porous material (METAPOR® Nonmetal types) offer the advantage that they can be easily machined, having a smooth surface (less friction), even air distribution and a reasonable price.
The material is ideal because it is more or less self-cleaning and therefore very durable. During the use with cleaned, compressed air this porous material is even suitable for clean room conditions.
METAPOR® CE 100 WHITE chucks are widely used in the microelecronic industry for wafer processing, IC assembly, chip- and wire bonding.
A micro-porous ceramic working disk produced out of a METAPOR® CE 100 WHITE slab is a special tool for clamping and bearing in various semiconductor wafer production processes, and is applied to processes such as thinning, dicing, grinding, cleaning and handling.
METAPOR® CE 100 WHITE can be used for new and refurbished porous ceramic chucks for various semiconductor machine producers.